Issued Patents All Time
Showing 51–75 of 84 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6428942 | Multilayer circuit structure build up method | Hunt Hang Jiang, Yasuhito Takahashi, Wen-chou Vincent Wang, Mark Thomas McCormack | 2002-08-06 |
| 6343171 | Systems based on opto-electronic substrates with electrical and optical interconnections and methods for making | Tetsuzo Yoshimura, Yashuhito Takahashi, Masaaki Inao, William T. Chou, Solomon I. Beilin +3 more | 2002-01-29 |
| 6239485 | Reduced cross-talk noise high density signal interposer with power and ground wrap | Michael G. Peters, Wen-chou Vincent Wang, Yasuhito Takahashi, William T. Chou, Solomon I. Beilin | 2001-05-29 |
| 6226171 | Power conducting substrates with high-yield integrated substrate capacitor | Solomon I. Beilin, William T. Chou, David D. Ngo, Michael G. Peters, James J. Roman +1 more | 2001-05-01 |
| 6197664 | Method for electroplating vias or through holes in substrates having conductors on both sides | Michael G. Peters, William T. Chou | 2001-03-06 |
| 6187652 | Method of fabrication of multiple-layer high density substrate | William T. Chou, Solomon I. Beilin, Michael G. Peters, Wen-chou Vincent Wang | 2001-02-13 |
| 6163957 | Multilayer laminated substrates with high density interconnects and methods of making the same | Hunt Hang Jiang, Thomas J. Massingill, Mark Thomas McCormack | 2000-12-26 |
| 6146241 | Apparatus for uniform chemical mechanical polishing by intermittent lifting and reversible rotation | Solomon I. Beilin | 2000-11-14 |
| 6102710 | Controlled impedance interposer substrate and method of making | Solomon I. Beilin, William T. Chou, David Kudzuma, Michael G. Peters, James J. Roman +4 more | 2000-08-15 |
| 6081026 | High density signal interposer with power and ground wrap | Wen-chou Vincent Wang, Yasuhito Takahashi, William T. Chou, Michael G. Peters, Solomon I. Beilin | 2000-06-27 |
| 6050832 | Chip and board stress relief interposer | Solomon I. Beilin, Wen-chou Vincent Wang | 2000-04-18 |
| 6047637 | Method of paste printing using stencil and masking layer | Albert W. Chan | 2000-04-11 |
| 6025244 | Self-aligned patterns by chemical-mechanical polishing particularly suited to the formation of MCM capacitors | Solomon I. Beilin | 2000-02-15 |
| 6019665 | Controlled retention of slurry in chemical mechanical polishing | Solomon I. Beilin | 2000-02-01 |
| 5930890 | Structure and fabrication procedure for a stable post | William T. Chou, Solomon I. Beilin, David A. Horine, David Kudzuma, Larry L. Moresco +1 more | 1999-08-03 |
| 5916453 | Methods of planarizing structures on wafers and substrates by polishing | Solomon I. Beilin, William T. Chou, Larry L. Moresco, Wen-chou Vincent Wang | 1999-06-29 |
| 5891354 | Methods of etching through wafers and substrates with a composite etch stop layer | Solomon I. Beilin, William T. Chou, Michael G. Peters, Wen-chou Vincent Wang | 1999-04-06 |
| 5872696 | Sputtered and anodized capacitors capable of withstanding exposure to high temperatures | Michael G. Peters, Solomon I. Beilin, Yasuhito Takahashi | 1999-02-16 |
| 5854534 | Controlled impedence interposer substrate | Solomon I. Beilin, William T. Chou, David Kudzuma, Michael G. Peters, James J. Roman +4 more | 1998-12-29 |
| 5778529 | Method of making a multichip module substrate | Solomon I. Beilin, William T. Chou, David Kudzuma, Teruo Murase, Michael G. Peters +3 more | 1998-07-14 |
| 5746903 | Wet chemical processing techniques for plating high aspect ratio features | Solomon I. Beilin, William T. Chou, Wen-chou Vincent Wang | 1998-05-05 |
| 5722162 | Fabrication procedure for a stable post | William T. Chou, Solomon I. Beilin, David A. Horine, David Kudzuma, Larry L. Moresco +1 more | 1998-03-03 |
| 5544017 | Multichip module substrate | Solomon I. Beilin, William T. Chou, David Kudzuma, Teruo Murase, Michael G. Peters +3 more | 1996-08-06 |
| 5476430 | Exercise treadmill with variable response to foot impact induced speed variation | Kelley A. Timmins | 1995-12-19 |
| 5454161 | Through hole interconnect substrate fabrication process | Solomon I. Beilin, Michael G. Peters, Wen-chou Vincent Wang | 1995-10-03 |