Issued Patents All Time
Showing 26–50 of 84 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7275109 | Network communication authentication | — | 2007-09-25 |
| 7257217 | Call features for automatic call distribution system | — | 2007-08-14 |
| 7229219 | Apparatuses and methods for integrating opto-electric components into the optical pathways of routing substrates with precision optical coupling and compact electrical interconnection | Kishio Yokouchi | 2007-06-12 |
| 7209621 | Optical apparatuses providing optical interconnections among a plurality of electronic components | Alexei Glebov, Kishio Yokouchi | 2007-04-24 |
| 7171065 | Compact optical devices and methods for making the same | Kishio Yokouchi | 2007-01-30 |
| 7083869 | Methods of forming LaNiO3 conductive layers, ferro-electric devices with LaNiO3 layers, and precursor formation solutions | Kuo-Chuan Liu, Kishio Yokouchi | 2006-08-01 |
| 7035489 | Thin film electro-optical deflector device and a method of fabrication of such a device | Alexei Glebov | 2006-04-25 |
| 6922508 | Optical switching apparatus with adiabatic coupling to optical fiber | Alexei Glebov, Shinya Sasaki | 2005-07-26 |
| 6898343 | Optical switching apparatus and method for fabricating | Alexei Glebov, Michael G. Peters, James J. Roman, David Kudzuma | 2005-05-24 |
| 6884313 | Method and system for joining and an ultra-high density interconnect | Kuo-Chuan Liu | 2005-04-26 |
| 6885781 | Thin film electro-optical deflector device and a method of fabrication of such a device | Alexei Glebov | 2005-04-26 |
| 6866741 | Method for joining large substrates | Albert W. Chan, Mark Thomas McCormack, Solomon I. Beilin | 2005-03-15 |
| 6845184 | Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making | Tetsuzo Yoshimura, Yashuhito Takahashi, Masaaki Inao, William T. Chou, Solomon I. Beilin +3 more | 2005-01-18 |
| 6823097 | Optical switching apparatus with divergence correction | Alexei Glebov | 2004-11-23 |
| 6800169 | Method for joining conductive structures and an electrical conductive article | Kuo-Chuan Liu | 2004-10-05 |
| 6733685 | Methods of planarizing structures on wafers and substrates by polishing | Solomon I. Beilin, William T. Chou, Larry L. Moresco, Wen-chou Vincent Wang | 2004-05-11 |
| 6730358 | Method for depositing conductive paste using stencil | Charbel Yamuni | 2004-05-04 |
| 6690845 | Three-dimensional opto-electronic modules with electrical and optical interconnections and methods for making | Tetsuzo Yoshimura, Yashuhito Takahashi, Masaaki Inao, William T. Chou, Solomon I. Beilin +3 more | 2004-02-10 |
| 6662443 | Method of fabricating a substrate with a via connection | William T. Chou, Solomon I. Beilin, Michael G. Peters, Wen-chou Vincent Wang | 2003-12-16 |
| 6611635 | Opto-electronic substrates with electrical and optical interconnections and methods for making | Tetsuzo Yoshimura, Yashuhito Takahashi, Masaaki Inao, William T. Chou, Solomon I. Beilin +3 more | 2003-08-26 |
| 6592943 | Stencil and method for depositing solder | Albert W. Chan, Theresa M. Larson | 2003-07-15 |
| 6543674 | Multilayer interconnection and method | Connie M. Wong, Wen-chou Vincent Wang | 2003-04-08 |
| 6518096 | Interconnect assembly and Z-connection method for fine pitch substrates | Albert W. Chan | 2003-02-11 |
| 6469394 | Conductive interconnect structures and methods for forming conductive interconnect structures | Connie M. Wong | 2002-10-22 |
| 6444921 | Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like | Wen-chou Vincent Wang, Solomon I. Beilin | 2002-09-03 |