SB

Scott D. Brandenburg

Delphi Technologies: 45 patents #9 of 4,124Top 1%
AA Aptiv Technologies Ag: 20 patents #10 of 863Top 2%
DE Delco Electronics: 6 patents #45 of 908Top 5%
📍 Kokomo, IN: #1 of 628 inventorsTop 1%
🗺 Indiana: #143 of 33,936 inventorsTop 1%
Overall (All Time): #28,408 of 4,157,543Top 1%
71
Patents All Time

Issued Patents All Time

Showing 51–71 of 71 patents

Patent #TitleCo-InventorsDate
7134194 Method of developing an electronic module Todd P. Oman, Micheal Miller 2006-11-14
7132746 Electronic assembly with solder-bonded heat sink Bruce A. Myers 2006-11-07
6905349 Technique for connector to printed circuit board decoupling to eliminate flexure David A. Laudick, Thomas A. Degenkolb, Larry M. Mandel, Richard D. Parker 2005-06-14
6875636 Wafer applied thermally conductive interposer David A. Laudick 2005-04-05
6833628 Mutli-chip module Darrel E. Peugh, Matthew R. Walsh 2004-12-21
6811892 Lead-based solder alloys containing copper Shing Yeh, Bradley H. Carter, Frank Stepniak 2004-11-02
6807731 Method for forming an electronic assembly Bruce A. Myers, Jeenhuei Tsai, Suresh K. Chengalva 2004-10-26
6779260 Overmolded electronic package including circuit-carrying substrate Thomas A. Degenkolb, Bruce A. Myers 2004-08-24
6693239 Overmolded circuit board with underfilled surface-mount component and method therefor Bruce A. Myers, Jeenhuei Tsai 2004-02-17
6619536 Solder process and solder alloy therefor Shing Yeh, Bradley H. Carter 2003-09-16
6593527 Integrated circuit assembly with bar bond attachment Robert Vajagich, Gary E. Oberlin 2003-07-15
6570260 Solder process and solder alloy therefor Shing Yeh, Bradley H. Carter 2003-05-27
6307749 Overmolded electronic module with underfilled surface-mount components Jeffery Ralph Daanen 2001-10-23
6285551 Overmolded electronic assembly Mark A. Koors, Jeffery Ralph Daanen 2001-09-04
6262489 Flip chip with backside electrical contact and assembly and method therefor Mark A. Koors, Robert Vajagich, Charles I. Delheimer, Gary E. Oberlin 2001-07-17
6180045 Method of forming an overmolded electronic assembly Mark A. Koors, Jeffery Ralph Daanen 2001-01-30
5914535 Flip chip-on-flip chip multi-chip module 1999-06-22
5774342 Electronic circuit with integrated terminal pins Jeffery Ralph Daanen 1998-06-30
5770477 Flip chip-on-flip chip multi-chip module 1998-06-23
5562498 Flexible capacitor filter William S. Murphy, David King 1996-10-08
5491364 Reduced stress terminal pattern for integrated circuit devices and packages William S. Murphy, Ahmer Syed, David King, Shing Yeh 1996-02-13