Issued Patents All Time
Showing 26–50 of 71 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8471380 | Fluid cooled encapsulated microelectronic package | Suresh K. Chengalva, Thomas A. Degenkolb | 2013-06-25 |
| 8026597 | Fluid cooled encapsulated microelectronic package | Suresh K. Chengalva, Thomas A. Degenkolb | 2011-09-27 |
| 7855685 | Microwave communication package | Matthew R. Walsh, Deepukumar M. Nair, David W. Zimmerman, Benjamen E. Haffke, Charles I. Delheimer +2 more | 2010-12-21 |
| 7739791 | Method of producing an overmolded electronic module with a flexible circuit pigtail | David A. Laudick, Gary E. Oberlin | 2010-06-22 |
| 7726972 | Liquid metal rotary connector apparatus for a vehicle steering wheel and column | Shing Yeh, Mark W. Gose | 2010-06-01 |
| 7621757 | Solderless electrical interconnection for electronic package | Thomas A. Degenkolb | 2009-11-24 |
| 7616448 | Wrap-around overmold for electronic assembly | Thomas A. Degenkolb, Larry M. Mandel, Kin Yean Chow, Ching Meng Fang, Sim Ying Yong | 2009-11-10 |
| 7603770 | Method of overmolding an electronic assembly having an insert-molded vertical mount connector header | David A. Laudick | 2009-10-20 |
| 7561436 | Circuit assembly with surface-mount IC package and heat sink | Bruce A. Myers | 2009-07-14 |
| 7553680 | Methods to provide and expose a diagnostic connector on overmolded electronic packages | Jeenhuei Tsai | 2009-06-30 |
| 7537464 | Electrical pin interconnection for electronic package | Thomas A. Degenkolb | 2009-05-26 |
| 7486515 | Fluid circulator for fluid cooled electronic device | Suresh K. Chengalva | 2009-02-03 |
| 7485957 | Fluid cooled encapsulated microelectronic package | Suresh K. Chengalva, Thomas A. Degenkolb | 2009-02-03 |
| 7473585 | Technique for manufacturing an overmolded electronic assembly | David A. Laudick | 2009-01-06 |
| 7447041 | Compression connection for vertical IC packages | Thomas A. Degenkolb, Shing Yeh | 2008-11-04 |
| 7440282 | Heat sink electronic package having compliant pedestal | Suresh K. Chengalva, David W. Zimmerman | 2008-10-21 |
| 7422448 | Surface mount connector | Thomas A. Degenkolb, Matthew R. Walsh | 2008-09-09 |
| 7364684 | Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels | Suresh K. Chengalva, Thomas A. Degenkolb | 2008-04-29 |
| 7352070 | Polymer encapsulated electrical devices | Thomas Ellis, Glen Novak, Bruce A. Myers, Jeenhuei Tsai | 2008-04-01 |
| 7307841 | Electronic package and method of cooling electronics | Carl W. Berlin, Suresh K. Chengalva, Bruce A. Myers | 2007-12-11 |
| 7268429 | Technique for manufacturing an overmolded electronic assembly | David A. Laudick, Thomas A. Degenkolb, Matthew R. Walsh, Jeenhuei Tsai | 2007-09-11 |
| 7230832 | Cooled electronic assembly and method for cooling a printed circuit board | Suresh K. Chengalva | 2007-06-12 |
| 7227758 | Printed circuit board assembly with integrated connector | Thomas A. Degenkolb | 2007-06-05 |
| 7205653 | Fluid cooled encapsulated microelectronic package | Suresh K. Chengalva, Thomas A. Degenkolb | 2007-04-17 |
| 7202571 | Electronic module with form in-place pedestal | Brian Thompson, Charles I. Delheimer, Derek B. Workman, Jeenhuei Tsai, Matthew R. Walsh | 2007-04-10 |