| 7752925 |
Seat belt assembly including resistive film for determining tension |
James F. Patterson |
2010-07-13 |
| 7641288 |
Omni-directional wheel design for construction cost reduction |
Andrew R. Baker |
2010-01-05 |
| 7268691 |
Weather/environment communications node |
Andrew R. Baker, Mark C. Hansen |
2007-09-11 |
| 6927678 |
Fluid filled seat bladder with capacitive sensors for occupant classification and weight estimation |
William W. Fultz, Dennis P. Griffin |
2005-08-09 |
| 6802381 |
Propulsion mechanism having spherical ball |
Andrew R. Baker |
2004-10-12 |
| 6684141 |
Electrical circuit module with magnetic detection of loose or detached state |
— |
2004-01-27 |
| 6434958 |
Ambient humidity compensation method for a vehicle climate control system |
Christopher M. Puranen |
2002-08-20 |
| 6365964 |
Heat-dissipating assembly for removing heat from a flip chip semiconductor device |
Glen W Devos |
2002-04-02 |
| 6285551 |
Overmolded electronic assembly |
Scott D. Brandenburg, Jeffery Ralph Daanen |
2001-09-04 |
| 6262489 |
Flip chip with backside electrical contact and assembly and method therefor |
Robert Vajagich, Charles I. Delheimer, Scott D. Brandenburg, Gary E. Oberlin |
2001-07-17 |
| 6180436 |
Method for removing heat from a flip chip semiconductor device |
Glen W Devos |
2001-01-30 |
| 6180045 |
Method of forming an overmolded electronic assembly |
Scott D. Brandenburg, Jeffery Ralph Daanen |
2001-01-30 |
| 6043937 |
Head up display system using a diffusing image plane |
Mark William Hudson, Ning Wu, Doyle Joseph Groves, Timothy J. Newman, Dale J. Igram +3 more |
2000-03-28 |
| 4747017 |
Surface mountable integrated circuit package equipped with sockets |
Phillip A. Lutz |
1988-05-24 |
| 4706811 |
Surface mount package for encapsulated tape automated bonding integrated circuit modules |
James Jung, Phillip A. Lutz |
1987-11-17 |
| 4605140 |
Tube closure member having toggle action |
— |
1986-08-12 |
