Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
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Mark A. Koors — 16 Patents

Delphi Technologies: 10 patents #264 of 4,124Top 7%
General Motors: 3 patents #4,723 of 18,328Top 30%
DEDelco Electronics: 2 patents #209 of 908Top 25%
Kokomo, IN: #30 of 628 inventorsTop 5%
Indiana: #2,086 of 33,936 inventorsTop 7%
Overall (All Time): #284,196 of 4,157,543Top 7%
16 Patents All Time
Mark A. Koors has been granted 16 US patents while listed as an inventor at Delphi Technologies. The first was granted in 1986 and the most recent in July 2010. Mark A. Koors ranks #284,196 of 4,157,543 US inventors in our database (top 6.8%). Patent records list Mark A. Koors in Kokomo, IN, US.

Issued Patents All Time

Showing 1–16 of 16 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
7752925 Seat belt assembly including resistive film for determining tension James F. Patterson 2010-07-13
7641288 Omni-directional wheel design for construction cost reduction Andrew R. Baker 2010-01-05
7268691 Weather/environment communications node Andrew R. Baker, Mark C. Hansen 2007-09-11
6927678 Fluid filled seat bladder with capacitive sensors for occupant classification and weight estimation William W. Fultz, Dennis P. Griffin 2005-08-09 $3,066,000
6802381 Propulsion mechanism having spherical ball Andrew R. Baker 2004-10-12 $956,000
6684141 Electrical circuit module with magnetic detection of loose or detached state 2004-01-27 $4,967,000
6434958 Ambient humidity compensation method for a vehicle climate control system Christopher M. Puranen 2002-08-20 $1,398,000
6365964 Heat-dissipating assembly for removing heat from a flip chip semiconductor device Glen W Devos 2002-04-02 $4,569,000
6285551 Overmolded electronic assembly Scott D. Brandenburg, Jeffery Ralph Daanen 2001-09-04 $29,883,000
6262489 Flip chip with backside electrical contact and assembly and method therefor Robert Vajagich, Charles I. Delheimer, Scott D. Brandenburg, Gary E. Oberlin 2001-07-17 $8,454,000
6180045 Method of forming an overmolded electronic assembly Scott D. Brandenburg, Jeffery Ralph Daanen 2001-01-30
6180436 Method for removing heat from a flip chip semiconductor device Glen W Devos 2001-01-30
6043937 Head up display system using a diffusing image plane Mark William Hudson, Ning Wu, Doyle Joseph Groves, Timothy J. Newman, Dale J. Igram +3 more 2000-03-28 $99,354,000
4747017 Surface mountable integrated circuit package equipped with sockets Phillip A. Lutz 1988-05-24
4706811 Surface mount package for encapsulated tape automated bonding integrated circuit modules James Jung, Phillip A. Lutz 1987-11-17
4605140 Tube closure member having toggle action 1986-08-12