Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 6365964 | Heat-dissipating assembly for removing heat from a flip chip semiconductor device | Mark A. Koors | 2002-04-02 | $4,569,000 |
| 6180436 | Method for removing heat from a flip chip semiconductor device | Mark A. Koors | 2001-01-30 |