Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 6593527 | Integrated circuit assembly with bar bond attachment | Scott D. Brandenburg, Gary E. Oberlin | 2003-07-15 | $2,284,000 |
| 6262489 | Flip chip with backside electrical contact and assembly and method therefor | Mark A. Koors, Charles I. Delheimer, Scott D. Brandenburg, Gary E. Oberlin | 2001-07-17 | $8,454,000 |