Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9120704 | Dielectric layer for electrostatic chuck and electrostatic chuck | Kouta Tsutsumi, Mitsuyoshi Nagano, Koki Tamagawa, Norio Shiraiwa, Tadayoshi Yoshikawa +3 more | 2015-09-01 |
| 7785671 | Thermal barrier coating system and method of manufacturing the same | Mineaki Matsumoto, Norio Yamaguchi, Kazushige Kimura, Yasuo Matsunaga, Kouichi Matsumoto +2 more | 2010-08-31 |
| 7410545 | Substrate processing method of and substrate processing apparatus for freezing and cleaning substrate | — | 2008-08-12 |
| 7364806 | Thermal barrier coating system method of manufacturing the same | Mineaki Matsumoto, Norio Yamaguchi, Kazushige Kimura, Yasuo Matsunaga, Kouichi Matsumoto +2 more | 2008-04-29 |
| 7279079 | Plating apparatus, cartridge and copper dissolution tank for use in the plating apparatus, and plating method | Yasuhiro Mizohata, Yoshihiro Koyama | 2007-10-09 |
| 7169269 | Plating apparatus, plating cup and cathode ring | Yasuhiro Mizohata, Masahiro Miyagi, Ryuichi Hayama | 2007-01-30 |
| 7025946 | Method for producing soft magnetic hexagonal ferrite sintered material and soft magnetic hexagonal ferrite sintered material | Yutaka Suematsu, Toru Matsuzaki, Yasuo Kondo, Hiroshi Nomura | 2006-04-11 |
| 6660665 | Platen for electrostatic wafer clamping apparatus | Hiroaki Yanagida, Yoshiki Okuhara, Shoji Aoki, Naoki Kawashima, Bruce T. Williams +1 more | 2003-12-09 |
| 5554939 | Non-destructive measuring sensor for semiconductor wafer and method of manufacturing the same | Sadao Hirae, Motohiro Kouno, Takamasa Sakai | 1996-09-10 |
| 5504437 | Apparatus and method for electrical measurement of semiconductor wafers | Sadao Hirae, Hiroshi Okada | 1996-04-02 |
| 5475319 | Method of measuring electric charge of semiconductor wafer | Sadao Hirae, Motohiro Kouno | 1995-12-12 |