Issued Patents All Time
Showing 51–65 of 65 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9136159 | Method and system for a semiconductor for device package with a die-to-packaging substrate first bond | Michael Kelly, Ronald Patrick Huemoeller, David Jon Hiner | 2015-09-15 |
| 9048125 | Semiconductor device and manufacturing method thereof | Jong Sik Paek, Doo Hyun Park, Eun Ho Park, Sung Jae Oh | 2015-06-02 |
| 9048241 | Semiconductor device utilzing redistribution layers to couple stacked die | Jong Sik Paek, Doo Hyun Park, Seong Min Seo, Pil Je Sung, Jin-Hee Park +5 more | 2015-06-02 |
| 9040349 | Method and system for a semiconductor device package with a die to interposer wafer first bond | Michael Kelly, Ronald Patrick Huemoeller, David Jon Hiner | 2015-05-26 |
| 9000586 | Semiconductor device and manufacturing method thereof | Doo Hyun Park, Jong Sik Paek, Ji Hun Lee, Seong Min Seo | 2015-04-07 |
| 8981572 | Conductive pad on protruding through electrode semiconductor device | Yong Jae Ko | 2015-03-17 |
| 8900995 | Semiconductor device and manufacturing method thereof | Yeon Seung Jung, Yong Jae Ko | 2014-12-02 |
| 8796072 | Method and system for a semiconductor device package with a die-to-die first bond | Michael Kelly, Ronald Patrick Huemoeller | 2014-08-05 |
| 8618658 | Semiconductor device and fabricating method thereof | Jong Sik Paek, Eun Sook Sohn | 2013-12-31 |
| 8552548 | Conductive pad on protruding through electrode semiconductor device | Yong Jae Ko | 2013-10-08 |
| 8487445 | Semiconductor device having through electrodes protruding from dielectric layer | Yeon Seung Jung, Yong Jae Ko | 2013-07-16 |
| 8410585 | Leadframe and semiconductor package made using the leadframe | Byung Hoon Ahn, Jae Hun Ku, Young Suk Chung, Suk Gu Ko, Sung Sik Jang +1 more | 2013-04-02 |
| 8362612 | Semiconductor device and manufacturing method thereof | Jong Sik Paek, Eun Sook Sohn, In Bae Park, Glenn Rinne | 2013-01-29 |
| 7138707 | Semiconductor package including leads and conductive posts for providing increased functionality | Seung Ju Lee, Kwang Eung Lee | 2006-11-21 |
| 7042068 | Leadframe and semiconductor package made using the leadframe | Byung Hoon Ahn, Jae Hun Ku, Young Suk Chung, Suk Gu Ko, Sung Sik Jang +1 more | 2006-05-09 |