Issued Patents All Time
Showing 26–50 of 65 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483222 | Semiconductor device and manufacturing method thereof | Jong Sik Paek, Eun Sook Sohn, In Bae Park, Glenn Rinne | 2019-11-19 |
| 10475770 | Semiconductor device having stacked dies and stacked pillars and method of manufacturing thereof | Won Geol Lee, Ji Hun Yi | 2019-11-12 |
| 10410967 | Electronic device comprising a conductive pad on a protruding-through electrode | Yong Jae Ko | 2019-09-10 |
| 10388582 | Semiconductor device and manufacturing method thereof | Young Rae Kim, Ji Hun Lee, Min Hwa Chang, Dong Hyun Kim, Wang Gu Lee +2 more | 2019-08-20 |
| 10340244 | Semiconductor device and manufacturing method thereof | Jae Hun Bae, Min Yoo, Young Rae Kim, Min Hwa Chang, Dong Hyun Kim +2 more | 2019-07-02 |
| 10297466 | Semiconductor device and manufacturing method thereof | Doo Hyun Park, Jong Sik Paek, Ji Hun Lee, Seong Min Seo | 2019-05-21 |
| 10283400 | Semiconductor device package and manufacturing method thereof | Michael Kelly, Ronald Patrick Huemoeller, David Jon Hiner | 2019-05-07 |
| 10090234 | Semiconductor device package and manufacturing method thereof | Michael Kelly, Ronald Patrick Huemoeller, David Jon Hiner | 2018-10-02 |
| 10008393 | Semiconductor device and manufacturing method thereof | Dong Jin Kim, Jin Han Kim, Jae Hun Bae, Won Myoung Ki, Dong Hoon Han +6 more | 2018-06-26 |
| 9966300 | Semiconductor device package and manufacturing method thereof | Michael Kelly, Ronald Patrick Huemoeller, David Jon Hiner | 2018-05-08 |
| 9966276 | Semiconductor device and manufacturing method thereof | Doo Hyun Park, Jong Sik Paek, Ji Hun Lee, Seong Min Seo | 2018-05-08 |
| 9947623 | Semiconductor device comprising a conductive pad on a protruding-through electrode | Yong Jae Ko | 2018-04-17 |
| 9941180 | Semiconductor device and manufacturing method thereof | Young Rae Kim, Ji Hun Lee, Min Hwa Chang, Dong Hyun Kim, Wang Gu Lee +2 more | 2018-04-10 |
| 9793180 | Semiconductor device and manufacturing method thereof | Seo Yeon Ahn, Doo Hyun Park, Pil Je Sung, Young Rae Kim, Seung Chul Han +2 more | 2017-10-17 |
| 9728514 | Semiconductor device and manufacturing method thereof | Jong Sik Paek, Doo Hyun Park, Eun Ho Park, Sung Jae Oh | 2017-08-08 |
| 9627353 | Method of manufacturing a semiconductor package | Michael Kelly, David Jon Hiner, Ji Hun Lee, Doo Hyun Park, Ronald Patrick Huemoeller | 2017-04-18 |
| 9553041 | Semiconductor device package and manufacturing method thereof | Michael Kelly, Ronald Patrick Huemoeller, David Jon Hiner | 2017-01-24 |
| 9536858 | Semiconductor device and manufacturing method thereof | Doo Hyun Park, Jong Sik Paek, Ji Hun Lee, Seong Min Seo | 2017-01-03 |
| 9524906 | Semiconductor device and manufacturing method thereof | Jong Sik Paek, Eun Sook Sohn, In Bae Park, Glenn Rinne | 2016-12-20 |
| 9437575 | Semiconductor device package formed in a chip-on-wafer last process using thin film adhesives | Michael Kelly, David Jon Hiner, Ji Hun Lee, Doo Hyun Park, Ronald Patrick Huemoeller | 2016-09-06 |
| 9431323 | Conductive pad on protruding through electrode | Yong Jae Ko | 2016-08-30 |
| 9391043 | Semiconductor device and manufacturing method thereof | Jong Sik Paek, Doo Hyun Park, Eun Ho Park, Sung Jae Oh | 2016-07-12 |
| 9362210 | Leadframe and semiconductor package made using the leadframe | Byung Hoon Ahn, Jae Hun Ku, Young Suk Chung, Suk Gu Ko, Sung Sik Jang +1 more | 2016-06-07 |
| 9349681 | Semiconductor device package and manufacturing method thereof | Michael Kelly, Ronald Patrick Huemoeller, David Jon Hiner | 2016-05-24 |
| 9190370 | Semiconductor device utilizing redistribution layers to couple stacked die | Jong Sik Paek, Doo Hyun Park, Pil Je Sung, Jin-Hee Park, Do Hyung Kim +4 more | 2015-11-17 |