Issued Patents All Time
Showing 26–43 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9165900 | Semiconductor package and process for fabricating same | Yuan-Chang Su, Shih-Fu Huang, Chia-Cheng Chen, Chia-Hsiung Hsieh, Tzu-Hui Chen +1 more | 2015-10-20 |
| 9054118 | Heat dissipating semiconductor device packages and related methods | Sheng-Ming Wang, Yu-Ying Lee, Hsiang-Ming Feng, Bing-Yun Cheng | 2015-06-09 |
| 8884424 | Semiconductor package with single sided substrate design and manufacturing methods thereof | Yuan-Chang Su, Shih-Fu Huang, Chia-Cheng Chen, Tzu-Hui Chen, Pao-Ming Hsieh +2 more | 2014-11-11 |
| 8866311 | Semiconductor package substrates having pillars and related methods | Tien-Szu Chen, Sheng-Ming Wang, Hsiang-Ming Feng, Yen-Hua Kuo | 2014-10-21 |
| 8786062 | Semiconductor package and process for fabricating same | Yuan-Chang Su, Shih-Fu Huang, Chia-Cheng Chen, Chia-Hsiung Hsieh, Tzu-Hui Chen +1 more | 2014-07-22 |
| 8779581 | Heat dissipating semiconductor device packages | Sheng-Ming Wang, Yu-Ying Lee, Hsiang-Ming Feng, Bing-Yun Cheng | 2014-07-15 |
| 8592962 | Semiconductor device packages with protective layer and related methods | Sheng-Ming Wang, Hsiang-Ming Feng, Yu-Ying Lee, Mei-Lin Hsieh | 2013-11-26 |
| 8569894 | Semiconductor package with single sided substrate design and manufacturing methods thereof | Yuan-Chang Su, Shih-Fu Huang, Chia-Cheng Chen, Tzu-Hui Chen, Pao-Ming Hsieh +2 more | 2013-10-29 |
| 8367473 | Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereof | Shih-Fu Huang, Yuan-Chang Su, Chia-Cheng Chen, Ta-Chun Lee | 2013-02-05 |
| 8330267 | Semiconductor package | Pao-Ming Hsieh, Yuan-Chang Su, Shih-Fu Huang, Bernd Karl Appelt | 2012-12-11 |
| 8309400 | Leadframe package structure and manufacturing method thereof | Bernd Karl Appelt, Kay Stefan Essig, Yuan-Chang Su, Chun-Che Lee | 2012-11-13 |
| 8304865 | Leadframe and chip package | Yueh Hsu, Mei-Lin Hsieh, Chih-Hung Hsu, Yi-Cheng Hsu | 2012-11-06 |
| 8288869 | Semiconductor package with substrate having single metal layer and manufacturing methods thereof | Shih-Fu Huang, Yuan-Chang Su, Chia-Cheng Chen, Ming-Chiang Lee, Bernd Karl Appelt +1 more | 2012-10-16 |
| 8273445 | Reinforced assembly carrier | Ren Yih Jeng, Chun-Hung Hsu | 2012-09-25 |
| 8143101 | Semiconductor package and the method of making the same | Yu-Ching Sun, Ren-Yi Cheng, Tsai Wan, Chih-Hung Hsu | 2012-03-27 |
| 8076765 | Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductors | Chi-Chih Shen, Jen-Chuan Chen, Wen-Hsiung Chang, Hui-Shan Chang, Pei-Yu Hsu +5 more | 2011-12-13 |
| 8058725 | Package structure and package substrate thereof | Chen-Ming Cheng, Hung-Ju Chung | 2011-11-15 |
| 7927924 | Semi-finished package and method for making a package | Ren-Yi Cheng, Chun-Hung Hsu | 2011-04-19 |