Issued Patents 2025
Showing 26–38 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300568 | High efficiency heat dissipation using discrete thermal interface material films | Yu-Chen Lee, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng | 2025-05-13 |
| 12300632 | Chip package with lid | Chin-Hua Wang, Kuang-Chun Lee, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng | 2025-05-13 |
| 12283553 | Semiconductor die with warpage release layer structure in package and fabricating method thereof | Chin-Hua Wang, Kuang-Chun Lee, Tsung-Yen Lee, Po-Yao Lin, Shin-Puu Jeng | 2025-04-22 |
| 12278156 | Semiconductor package | Chin-Hua Wang, Po-Yao Lin, Feng-Cheng Hsu, Shin-Puu Jeng, Wen-Yi Lin | 2025-04-15 |
| 12266635 | Semiconductor device package having dummy dies | Che-Chia Yang, Po-Chen Lai, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2025-04-01 |
| 12255118 | Package structure and method of fabricating the same | Yu-Sheng Lin, Po-Yao Lin, Chin-Hua Wang, Shin-Puu Jeng | 2025-03-18 |
| 12255156 | Semiconductor package with riveting structure between two rings and method for forming the same | Chien-Hung Chen, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2025-03-18 |
| 12249568 | Metallization structure | Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2025-03-11 |
| 12237276 | Package structure | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Che-Chia Yang, Po-Yao Lin +1 more | 2025-02-25 |
| 12237277 | Package structure and methods of manufacturing the same | Po-Yao Lin, Chin-Hua Wang, Chia-Kuei Hsu, Shin-Puu Jeng | 2025-02-25 |
| 12232307 | Dummy metal bonding pads for underfill application in semiconductor die packaging and methods of forming the same | Ming-Chih Yew, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2025-02-18 |
| 12218023 | Semiconductor package and method of forming the same | Yu-Sheng Lin, Chin-Hua Wang, Chien-Hung Chen, Po-Yao Lin, Shin-Puu Jeng | 2025-02-04 |
| 12191294 | Package structure and method of forming the same | Po-Yao Lin, Chin-Hua Wang, Yu-Sheng Lin, Shin-Puu Jeng | 2025-01-07 |