Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142567 | Coreless architecture and processing strategy for EMIB-based substrates with high accuracy and high density | Xiao Di SUN ZHOU, Debendra Mallik | 2024-11-12 |
| 11990427 | Chiplet first architecture for die tiling applications | Srinivas V. Pietambaram, Gang Duan, Deepak Kulkarni, Rahul N. Manepalli | 2024-05-21 |
| 11973041 | Chiplet first architecture for die tiling applications | Srinivas V. Pietambaram, Gang Duan, Deepak Kulkarni, Rahul N. Manepalli | 2024-04-30 |
| 11955448 | Architecture to manage FLI bump height delta and reliability needs for mixed EMIB pitches | Jung Kyu Han, Hongxia Feng, Rahul N. Manepalli | 2024-04-09 |
| 11948898 | Etch barrier for microelectronic packaging conductive structures | Kristof Darmawikarta, Srinivas V. Pietambaram, Hongxia Feng, Benjamin Duong | 2024-04-02 |
| 11942334 | Microelectronic assemblies having conductive structures with different thicknesses | Jeremy Ecton, Aleksandar Aleksov, Suddhasattwa Nad, Kristof Darmawikarta, Vahidreza Parichehreh +1 more | 2024-03-26 |
| 11881182 | Light-emitting device driver chip, backlight module, and display panel | — | 2024-01-23 |