Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176292 | Microelectronic component having molded regions with through-mold vias | Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba, Manish Dubey +1 more | 2024-12-24 |
| 12170273 | Integrated circuit assemblies with direct chip attach to circuit boards | Wilfred Gomes, Abhishek A. Sharma, Doug B. Ingerly, Mauro J. Kobrinsky, Kevin J. Fischer | 2024-12-17 |
| 12142568 | Multi-die ultrafine pitch patch architecture of interconnect bridge over glass layer and method of making | Kevin Thomas McCarthy, Leigh M. TRIBOLET, Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman | 2024-11-12 |
| 11978727 | Package on active silicon semiconductor packages | Wilfred Gomes, Doug B. Ingerly, Robert L. Sankman, Mark Bohr, Debendra Mallik | 2024-05-07 |
| 11869842 | Scalable high speed high bandwidth IO signaling package architecture and method of making | Robert L. Sankman, Arghya Sain, Sri Chaitra Jyotsna Chavali, Lijiang Wang, Cemil Geyik | 2024-01-09 |