Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154710 | Package embedded magnetic power transformers for SMPS | Anuj Modi, Huong Do, William J. Lambert, Harish Krishnamurthy | 2024-11-26 |
| 12087682 | Power delivery structures | Adel A. Elsherbini, Feras Eid, Georgios Dogiamis, Beomseok Choi, Henning Braunisch +2 more | 2024-09-10 |
| 12068684 | Multi-phase switching regulators with hybrid inductors and per phase frequency control | Christopher Schaef, William J. Lambert, Kaladhar Radhakrishnan | 2024-08-20 |
| 12062631 | Microelectronic assemblies with inductors in direct bonding regions | Adel A. Elsherbini, Kevin P. O'Brien, Kimin Jun, Han Wui Then, Mohammad Enamul Kabir +5 more | 2024-08-13 |
| 12002745 | High performance integrated RF passives using dual lithography process | Adel A. Elsherbini, Mathew J. Manusharow, William J. Lambert, Robert L. Sankman, Aleksandar Aleksov +6 more | 2024-06-04 |
| 11955426 | Package-integrated multi-turn coil embedded in a package magnetic core | Huong Do, Kaladhar Radhakrishnan, Yikang Deng, Amruthavalli Pallavi Alur | 2024-04-09 |
| 11916006 | Microelectronic assemblies having an integrated voltage regulator chiplet | Adel A. Elsherbini, Kaladhar Radhakrishnan, Shawna M. Liff, Johanna M. Swan | 2024-02-27 |
| 11881457 | Semiconductor packaging with high density interconnects | Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Henning Braunisch, Javier Soto Gonzalez +1 more | 2024-01-23 |