| 12183630 |
Additive interconnect formation |
Ashim Dutta, Chih-Chao Yang, Jennifer Church |
2024-12-31 |
| 12125790 |
Airgap isolation for back-end-of-the-line semiconductor interconnect structure with top via |
Ashim Dutta, Praveen Joseph, Jennifer Church |
2024-10-22 |
| 12033856 |
Litho-litho-etch (LLE) multi color resist |
Yann Mignot, Dario L. Goldfarb |
2024-07-09 |
| 12019376 |
Polymer brush adhesion promoter with UV cleavable linker |
Jing Guo, Bharat Kumar, Jennifer Church, Dario L. Goldfarb, Nelson Felix |
2024-06-25 |
| 12020949 |
Subtractive patterning of interconnect structures |
Dominik Metzler, Somnath Ghosh, John C. Arnold |
2024-06-25 |
| 12002856 |
Vertical field effect transistor with crosslink fin arrangement |
Indira Seshadri, Ruilong Xie, Chen Zhang |
2024-06-04 |
| 11990342 |
Metal cut patterning and etching to minimize interlayer dielectric layer loss |
Kisup Chung, Andrew M. Greene, Siva Kanakasabapathy, Indira Seshadri |
2024-05-21 |
| 11935931 |
Selective shrink for contact trench |
Ruilong Xie, Jing Guo, Abraham Arceo de la Pena |
2024-03-19 |
| 11923311 |
Forming self-aligned multi-metal interconnects |
Ashim Dutta |
2024-03-05 |
| 11923246 |
Via CD controllable top via structure |
Koichi Motoyama, Dominik Metzler, Chanro Park, Hsueh-Chung Chen |
2024-03-05 |
| 11916143 |
Vertical transport field-effect transistor with gate patterning |
Ruilong Xie, Wenyu Xu, Indira Seshadri, Jing Guo |
2024-02-27 |
| 11906901 |
Alternating copolymer chain scission photoresists |
Dario L. Goldfarb, Jing Guo, Jennifer Church, Luciana Meli |
2024-02-20 |
