Issued Patents 2024
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12167700 | Replacement bottom electrode structure for MRAM devices | Oscar van der Straten, Joseph F. Maniscalco, Chih-Chao Yang | 2024-12-10 |
| 12148617 | Structure and method to pattern pitch lines | Chanro Park, Chi-Chun Liu, Stuart A. Sieg, Yann Mignot, Hsueh-Chung Chen | 2024-11-19 |
| 12108685 | Multi-diameter magnetic random-access memory pillar structure | Oscar van der Straten, Joseph F. Maniscalco, Chih-Chao Yang | 2024-10-01 |
| 12087624 | Beol tip-to-tip shorting and time dependent dielectric breakdown | Chanro Park, Kenneth Chun Kuen Cheng, Chih-Chao Yang | 2024-09-10 |
| 12062609 | Electronic fuse structure embedded in top via | Chanro Park, Hsueh-Chung Chen, Chih-Chao Yang | 2024-08-13 |
| 12057395 | Top via interconnects without barrier metal between via and above line | Kenneth Chun Kuen Cheng, Chanro Park, Chih-Chao Yang | 2024-08-06 |
| 12040230 | Encapsulated top via interconnects | Oscar van der Straten, Kenneth Chun Kuen Cheng, Joseph F. Maniscalco | 2024-07-16 |
| 12027416 | BEOL etch stop layer without capacitance penalty | Chanro Park, Kenneth Chun Kuen Cheng, Chih-Chao Yang | 2024-07-02 |
| 12002498 | Coaxial top MRAM electrode | Oscar van der Straten, Chih-Chao Yang | 2024-06-04 |
| 11972977 | Fabrication of rigid close-pitch interconnects | Chanro Park, Kenneth Chun Kuen Cheng, Kisik Choi | 2024-04-30 |
| 11923246 | Via CD controllable top via structure | Dominik Metzler, Ekmini Anuja De Silva, Chanro Park, Hsueh-Chung Chen | 2024-03-05 |
| 11908732 | Alternating spacers for pitch structure | Hsueh-Chung Chen, Chanro Park | 2024-02-20 |
| 11887641 | Simultaneous electrodes for magneto-resistive random access memory devices | Oscar van der Straten, Chih-Chao Yang | 2024-01-30 |
| 11881431 | Anti-fuse with laterally extended liner | Chanro Park, Kenneth Chun Kuen Cheng, Chih-Chao Yang | 2024-01-23 |