Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087624 | Beol tip-to-tip shorting and time dependent dielectric breakdown | Chanro Park, Koichi Motoyama, Chih-Chao Yang | 2024-09-10 |
| 12057395 | Top via interconnects without barrier metal between via and above line | Koichi Motoyama, Chanro Park, Chih-Chao Yang | 2024-08-06 |
| 12040230 | Encapsulated top via interconnects | Oscar van der Straten, Joseph F. Maniscalco, Koichi Motoyama | 2024-07-16 |
| 12027416 | BEOL etch stop layer without capacitance penalty | Chanro Park, Koichi Motoyama, Chih-Chao Yang | 2024-07-02 |
| 11972977 | Fabrication of rigid close-pitch interconnects | Chanro Park, Koichi Motoyama, Kisik Choi | 2024-04-30 |
| 11881431 | Anti-fuse with laterally extended liner | Chanro Park, Koichi Motoyama, Chih-Chao Yang | 2024-01-23 |