KC

Kisik Choi

IBM: 9 patents #99 of 5,109Top 2%
📍 Watervliet, NY: #2 of 16 inventorsTop 15%
🗺 New York: #197 of 12,119 inventorsTop 2%
Overall (2024): #11,278 of 561,600Top 3%
9
Patents 2024

Issued Patents 2024

Showing 1–9 of 9 patents

Patent #TitleCo-InventorsDate
12148663 Tiered-profile contact for semiconductor Kangguo Cheng 2024-11-19
12087691 Semiconductor structures with backside gate contacts Ruilong Xie, Julien Frougier, Veeraraghavan S. Basker, Lawrence A. Clevenger, Nicolas Loubet +3 more 2024-09-10
11990410 Top via interconnect having a line with a reduced bottom dimension Brent A. Anderson, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Christopher J. Penny, Robert R. Robison 2024-05-21
11990412 Buried power rails located in a base layer including first, second, and third etch stop layers Ruilong Xie, Stuart A. Sieg, Somnath Ghosh, Rishikesh Krishnan, Alexander Reznicek 2024-05-21
11972977 Fabrication of rigid close-pitch interconnects Chanro Park, Kenneth Chun Kuen Cheng, Koichi Motoyama 2024-04-30
11961759 Interconnects having spacers for improved top via critical dimension and overlay tolerance Brent A. Anderson, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Christopher J. Penny, Robert R. Robison 2024-04-16
11915966 Backside power rail integration Ruilong Xie, Takeshi Nogami, Roy R. Yu, Balasubramanian Pranatharthiharan, Albert M. Young +1 more 2024-02-27
11894265 Top via with damascene line and via Lawrence A. Clevenger, Brent A. Anderson, Nicholas Anthony Lanzillo, Christopher J. Penny, Robert R. Robison 2024-02-06
11869808 Top via process with damascene metal Lawrence A. Clevenger, Brent A. Anderson, Nicholas Anthony Lanzillo, Christopher J. Penny, Robert R. Robison 2024-01-09