Issued Patents 2024
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142525 | Self-aligning spacer tight pitch via | Lawrence A. Clevenger, Nicholas Anthony Lanzillo | 2024-11-12 |
| 12136655 | Backside electrical contacts to buried power rails | Ruilong Xie, Albert M. Young, Kangguo Cheng, Julien Frougier, Balasubramanian Pranatharthiharan +2 more | 2024-11-05 |
| RE50181 | Isolation region fabrication for replacement gate processing | Edward J. Nowak | 2024-10-22 |
| 12057371 | Semiconductor device with early buried power rail (BPR) and backside power distribution network (BSPDN) | Ruilong Xie, Balasubramanian Pranatharthiharan, Mukta G. Farooq | 2024-08-06 |
| 12040250 | Heat pipe for vertically stacked field effect transistors | Terence B. Hook, Anthony I. Chou | 2024-07-16 |
| 12034005 | Self-aligned metal gate with poly silicide for vertical transport field-effect transistors | Ruqiang Bao, Dechao Guo, Vijay Narayanan | 2024-07-09 |
| 12002874 | Buried power rail contact | Junli Wang, Ruilong Xie, Chen Zhang, Heng Wu | 2024-06-04 |
| 12001772 | Ultra-short-height standard cell architecture | Albert M. Chu, Junli Wang | 2024-06-04 |
| 11990410 | Top via interconnect having a line with a reduced bottom dimension | Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Christopher J. Penny, Kisik Choi, Robert R. Robison | 2024-05-21 |
| 11961759 | Interconnects having spacers for improved top via critical dimension and overlay tolerance | Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Christopher J. Penny, Kisik Choi, Robert R. Robison | 2024-04-16 |
| 11915966 | Backside power rail integration | Ruilong Xie, Takeshi Nogami, Roy R. Yu, Balasubramanian Pranatharthiharan, Albert M. Young +1 more | 2024-02-27 |
| 11901440 | Sacrificial fin for self-aligned contact rail formation | Yann Mignot, Christopher J. Waskiewicz, Su Chen Fan, Junli Wang | 2024-02-13 |
| 11894265 | Top via with damascene line and via | Lawrence A. Clevenger, Kisik Choi, Nicholas Anthony Lanzillo, Christopher J. Penny, Robert R. Robison | 2024-02-06 |
| 11869808 | Top via process with damascene metal | Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Christopher J. Penny, Kisik Choi, Robert R. Robison | 2024-01-09 |