Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12106969 | Substrate thinning for a backside power distribution network | Ruilong Xie, Balasubramanian Pranatharthiharan, Julien Frougier, Takeshi Nogami, Roy R. Yu +1 more | 2024-10-01 |
| 12057371 | Semiconductor device with early buried power rail (BPR) and backside power distribution network (BSPDN) | Ruilong Xie, Balasubramanian Pranatharthiharan, Brent A. Anderson | 2024-08-06 |
| 12015003 | High density interconnection and wiring layers, package structures, and integration methods | John U. Knickerbocker, Katsuyuki Sakuma | 2024-06-18 |
| 11984401 | Stacked FET integration with BSPDN | Ruilong Xie, Junli Wang, Dechao Guo | 2024-05-14 |
| 11973058 | Multiple die assembly | Katsuyuki Sakuma, John U. Knickerbocker | 2024-04-30 |
| 11887956 | Temperature hierarchy solder bonding | Katsuyuki Sakuma | 2024-01-30 |