Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136655 | Backside electrical contacts to buried power rails | Ruilong Xie, Brent A. Anderson, Albert M. Young, Kangguo Cheng, Julien Frougier +2 more | 2024-11-05 |
| 12106969 | Substrate thinning for a backside power distribution network | Ruilong Xie, Balasubramanian Pranatharthiharan, Mukta G. Farooq, Julien Frougier, Roy R. Yu +1 more | 2024-10-01 |
| 12087685 | Semiconductor interconnect structure with double conductors | Benjamin D. Briggs, Raghuveer R. Patlolla | 2024-09-10 |
| 12002758 | Backside metal-insulator-metal (MIM) capacitors extending through backside interlayer dielectric (BILD) layer or semiconductor layer and partly through dielectric layer | Ruilong Xie, Roy R. Yu, Balasubramanian Pranatharthiharan, Chih-Chao Yang | 2024-06-04 |
| 11942426 | Semiconductor structure having alternating selective metal and dielectric layers | Son V. Nguyen, Balasubramanian Pranatharthiharan | 2024-03-26 |
| 11915966 | Backside power rail integration | Ruilong Xie, Roy R. Yu, Balasubramanian Pranatharthiharan, Albert M. Young, Kisik Choi +1 more | 2024-02-27 |
| 11908734 | Composite interconnect formation using graphene | Son V. Nguyen, Balasubramanian Pranatharthiharan | 2024-02-20 |