Issued Patents 2024
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183630 | Additive interconnect formation | Ashim Dutta, Ekmini Anuja De Silva, Jennifer Church | 2024-12-31 |
| 12167700 | Replacement bottom electrode structure for MRAM devices | Oscar van der Straten, Koichi Motoyama, Joseph F. Maniscalco | 2024-12-10 |
| 12144263 | Stepped contact within memory region | Ashim Dutta, Lili Cheng | 2024-11-12 |
| 12133473 | Contact structure formation for memory devices | Ashim Dutta | 2024-10-29 |
| 12120963 | Contact structure formation for memory devices | Lili Cheng, Ashim Dutta | 2024-10-15 |
| 12108685 | Multi-diameter magnetic random-access memory pillar structure | Oscar van der Straten, Koichi Motoyama, Joseph F. Maniscalco | 2024-10-01 |
| 12100653 | Resistance tunable fuse structure formed by embedded thin metal layers | Alexander Reznicek, Miaomiao Wang, Donald F. Canaperi | 2024-09-24 |
| 12087624 | Beol tip-to-tip shorting and time dependent dielectric breakdown | Chanro Park, Koichi Motoyama, Kenneth Chun Kuen Cheng | 2024-09-10 |
| 12062609 | Electronic fuse structure embedded in top via | Koichi Motoyama, Chanro Park, Hsueh-Chung Chen | 2024-08-13 |
| 12057395 | Top via interconnects without barrier metal between via and above line | Koichi Motoyama, Kenneth Chun Kuen Cheng, Chanro Park | 2024-08-06 |
| 12058942 | MRAM cell embedded in a metal layer | Ashim Dutta | 2024-08-06 |
| 12027416 | BEOL etch stop layer without capacitance penalty | Chanro Park, Koichi Motoyama, Kenneth Chun Kuen Cheng | 2024-07-02 |
| 12002498 | Coaxial top MRAM electrode | Oscar van der Straten, Koichi Motoyama | 2024-06-04 |
| 12002758 | Backside metal-insulator-metal (MIM) capacitors extending through backside interlayer dielectric (BILD) layer or semiconductor layer and partly through dielectric layer | Ruilong Xie, Takeshi Nogami, Roy R. Yu, Balasubramanian Pranatharthiharan | 2024-06-04 |
| 11990414 | BEOL alternative metal interconnects: integration and process | Theo Standaert | 2024-05-21 |
| 11955152 | Dielectric fill for tight pitch MRAM pillar array | Ashim Dutta, Theodorus E. Standaert, Daniel C. Edelstein | 2024-04-09 |
| 11942424 | Via patterning for integrated circuits | Tao Li, Ruilong Xie, Tsung-Sheng Kang | 2024-03-26 |
| 11937435 | High density two-tier MRAM structure | Ashim Dutta | 2024-03-19 |
| 11937514 | High-density memory devices using oxide gap fill | Theodorus E. Standaert, Daniel C. Edelstein | 2024-03-19 |
| 11908888 | Metal-insulator-metal capacitor structure supporting different voltage applications | Baozhen Li, Nan Jing, Huimei Zhou | 2024-02-20 |
| 11910722 | Subtractive top via as a bottom electrode contact for an embedded memory | Ashim Dutta | 2024-02-20 |
| 11908738 | Interconnect including integrally formed capacitor | Nicholas Anthony Lanzillo | 2024-02-20 |
| 11901224 | Rework for metal interconnects using etch and thermal anneal | Prasad Bhosale, Terry A. Spooner, Lawrence A. Clevenger | 2024-02-13 |
| 11887641 | Simultaneous electrodes for magneto-resistive random access memory devices | Oscar van der Straten, Koichi Motoyama | 2024-01-30 |
| 11881433 | Advanced copper interconnects with hybrid microstructure | Daniel C. Edelstein | 2024-01-23 |