Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033892 | Structure and method to improve FAV RIE process margin and electromigration | Benjamin D. Briggs, Joe Lee | 2024-07-09 |
| 11955152 | Dielectric fill for tight pitch MRAM pillar array | Ashim Dutta, Chih-Chao Yang, Daniel C. Edelstein | 2024-04-09 |
| 11937514 | High-density memory devices using oxide gap fill | Daniel C. Edelstein, Chih-Chao Yang | 2024-03-19 |
| 11869783 | Optimizating semiconductor binning by feed-forward process adjustment | Benjamin D. Briggs, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Michael Rizzolo, James H. Stathis | 2024-01-09 |