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Additive interconnect formation |
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| 12144263 |
Stepped contact within memory region |
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| 12133473 |
Contact structure formation for memory devices |
Chih-Chao Yang |
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| 12125790 |
Airgap isolation for back-end-of-the-line semiconductor interconnect structure with top via |
Ekmini Anuja De Silva, Praveen Joseph, Jennifer Church |
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| 12120963 |
Contact structure formation for memory devices |
Lili Cheng, Chih-Chao Yang |
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| 12058942 |
MRAM cell embedded in a metal layer |
Chih-Chao Yang |
2024-08-06 |
| 11955152 |
Dielectric fill for tight pitch MRAM pillar array |
Chih-Chao Yang, Theodorus E. Standaert, Daniel C. Edelstein |
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| 11937435 |
High density two-tier MRAM structure |
Chih-Chao Yang |
2024-03-19 |
| 11923311 |
Forming self-aligned multi-metal interconnects |
Ekmini Anuja De Silva |
2024-03-05 |
| 11910722 |
Subtractive top via as a bottom electrode contact for an embedded memory |
Chih-Chao Yang |
2024-02-20 |
| 11876047 |
Decoupled interconnect structures |
Saumya Sharma, Tianji Zhou, Chih-Chao Yang |
2024-01-16 |
