Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125790 | Airgap isolation for back-end-of-the-line semiconductor interconnect structure with top via | Ashim Dutta, Ekmini Anuja De Silva, Jennifer Church | 2024-10-22 |
| 11876136 | Transistor having wrap-around source/drain contacts and under-contact spacers | Yi Song, Andrew M. Greene, Kangguo Cheng | 2024-01-16 |
| 11864069 | Network slice based billing | Amit Agarwal, Rajpal Bhoria | 2024-01-02 |