Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183630 | Additive interconnect formation | Ashim Dutta, Ekmini Anuja De Silva, Chih-Chao Yang | 2024-12-31 |
| 12125790 | Airgap isolation for back-end-of-the-line semiconductor interconnect structure with top via | Ashim Dutta, Ekmini Anuja De Silva, Praveen Joseph | 2024-10-22 |
| 12019376 | Polymer brush adhesion promoter with UV cleavable linker | Jing Guo, Bharat Kumar, Ekmini Anuja De Silva, Dario L. Goldfarb, Nelson Felix | 2024-06-25 |
| 11906901 | Alternating copolymer chain scission photoresists | Dario L. Goldfarb, Ekmini Anuja De Silva, Jing Guo, Luciana Meli | 2024-02-20 |