Issued Patents 2024
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148617 | Structure and method to pattern pitch lines | Chanro Park, Chi-Chun Liu, Stuart A. Sieg, Yann Mignot, Koichi Motoyama | 2024-11-19 |
| 12142562 | Subtractive metal etch with improved isolation for BEOL interconnect and cross point | Yann Mignot, Chanro Park | 2024-11-12 |
| 12142556 | X-ray shielding structure for a chip | Yann Mignot, Mary Claire Silvestre, Effendi Leobandung | 2024-11-12 |
| 12113013 | Dual color via patterning | Yann Mignot, Su Chen Fan, Mary Claire Silvestre, Chi-Chun Liu, Junli Wang | 2024-10-08 |
| 12094774 | Back-end-of-line single damascene top via spacer defined by pillar mandrels | Yann Mignot, Yongan Xu | 2024-09-17 |
| 12062609 | Electronic fuse structure embedded in top via | Koichi Motoyama, Chanro Park, Chih-Chao Yang | 2024-08-13 |
| 12010930 | Wrap-around projection liner for AI device | Injo Ok, Mary Claire Silvestre, Yann Mignot | 2024-06-11 |
| 11977614 | Circuit design watermarking | Carl Radens, Lawrence A. Clevenger, Daniel James Dechene | 2024-05-07 |
| 11923246 | Via CD controllable top via structure | Koichi Motoyama, Dominik Metzler, Ekmini Anuja De Silva, Chanro Park | 2024-03-05 |
| 11908732 | Alternating spacers for pitch structure | Chanro Park, Koichi Motoyama | 2024-02-20 |