Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148617 | Structure and method to pattern pitch lines | Chanro Park, Chi-Chun Liu, Stuart A. Sieg, Koichi Motoyama, Hsueh-Chung Chen | 2024-11-19 |
| 12142562 | Subtractive metal etch with improved isolation for BEOL interconnect and cross point | Chanro Park, Hsueh-Chung Chen | 2024-11-12 |
| 12142556 | X-ray shielding structure for a chip | Hsueh-Chung Chen, Mary Claire Silvestre, Effendi Leobandung | 2024-11-12 |
| 12113013 | Dual color via patterning | Hsueh-Chung Chen, Su Chen Fan, Mary Claire Silvestre, Chi-Chun Liu, Junli Wang | 2024-10-08 |
| 12094774 | Back-end-of-line single damascene top via spacer defined by pillar mandrels | Yongan Xu, Hsueh-Chung Chen | 2024-09-17 |
| 12033856 | Litho-litho-etch (LLE) multi color resist | Ekmini Anuja De Silva, Dario L. Goldfarb | 2024-07-09 |
| 12010930 | Wrap-around projection liner for AI device | Injo Ok, Hsueh-Chung Chen, Mary Claire Silvestre | 2024-06-11 |
| 11916013 | Via interconnects including super vias | Christopher J. Waskiewicz, Eric R. Miller, Chanro Park | 2024-02-27 |
| 11901440 | Sacrificial fin for self-aligned contact rail formation | Christopher J. Waskiewicz, Su Chen Fan, Brent A. Anderson, Junli Wang | 2024-02-13 |