Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170252 | Electronic substrate stacking | Lei Shan, Daniel J. Friedman, Griselda Bonilla | 2024-12-17 |
| 12014816 | Multi-sensor platform for health monitoring | Bing Dang, Qianwen Chen, Leanna Pancoast | 2024-06-18 |
| 12015003 | High density interconnection and wiring layers, package structures, and integration methods | Mukta G. Farooq, Katsuyuki Sakuma | 2024-06-18 |
| 11973058 | Multiple die assembly | Katsuyuki Sakuma, Mukta G. Farooq | 2024-04-30 |
| 11908723 | Silicon handler with laser-release layers | Akihiro Horibe, Qianwen Chen, Risa Miyazawa, Michael P. Belyansky, Takashi Hisada | 2024-02-20 |
| 11903734 | Wearable multiplatform sensor | Rajeev Narayanan, Katsuyuki Sakuma, Bucknell C. Webb | 2024-02-20 |
| 11876233 | Thin film battery stacking | Bing Dang, Qianwen Chen | 2024-01-16 |