Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183708 | Double resist structure for electrodeposition bonding | Koki Nakamura, Toyohiro Aoki | 2024-12-31 |
| 12166008 | Injection molded solder head with improved sealing performance | Sayuri Hada, Toyohiro Aoki, Shintaro Yamamichi | 2024-12-10 |
| 12142603 | Bonding of bridge to multiple semiconductor chips | Akihiro Horibe, Takahito Watanabe, Toyohiro Aoki, Hiroyuki Mori | 2024-11-12 |
| 12094825 | Interconnection between chips by bridge chip | Akihiro Horibe, Toyohiro Aoki | 2024-09-17 |
| 11969828 | Prevention of dripping of material for material injection | Toyohiro Aoki, Eiji Nakamura | 2024-04-30 |
| 11908723 | Silicon handler with laser-release layers | Akihiro Horibe, Qianwen Chen, Risa Miyazawa, Michael P. Belyansky, John U. Knickerbocker | 2024-02-20 |