Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166008 | Injection molded solder head with improved sealing performance | Toyohiro Aoki, Takashi Hisada, Shintaro Yamamichi | 2024-12-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166008 | Injection molded solder head with improved sealing performance | Toyohiro Aoki, Takashi Hisada, Shintaro Yamamichi | 2024-12-10 |