Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183708 | Double resist structure for electrodeposition bonding | Koki Nakamura, Takashi Hisada | 2024-12-31 |
| 12166008 | Injection molded solder head with improved sealing performance | Sayuri Hada, Takashi Hisada, Shintaro Yamamichi | 2024-12-10 |
| 12142603 | Bonding of bridge to multiple semiconductor chips | Akihiro Horibe, Takahito Watanabe, Takashi Hisada, Hiroyuki Mori | 2024-11-12 |
| 12094825 | Interconnection between chips by bridge chip | Akihiro Horibe, Takashi Hisada | 2024-09-17 |
| 11969828 | Prevention of dripping of material for material injection | Eiji Nakamura, Takashi Hisada | 2024-04-30 |