Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142603 | Bonding of bridge to multiple semiconductor chips | Takahito Watanabe, Toyohiro Aoki, Takashi Hisada, Hiroyuki Mori | 2024-11-12 |
| 12094825 | Interconnection between chips by bridge chip | Toyohiro Aoki, Takashi Hisada | 2024-09-17 |
| 12087596 | Controlling of height of high-density interconnection structure on substrate | Keishi Okamoto, Hiroyuki Mori | 2024-09-10 |
| 11908723 | Silicon handler with laser-release layers | Qianwen Chen, Risa Miyazawa, Michael P. Belyansky, John U. Knickerbocker, Takashi Hisada | 2024-02-20 |