Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087596 | Controlling of height of high-density interconnection structure on substrate | Akihiro Horibe, Hiroyuki Mori | 2024-09-10 |
KO
Keishi Okamoto
Overall (2024): #385,770 of 561,600Top 70%
1
Patents 2024