Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12171202 | Rearing apparatus | Shigekazu Kawai, Yasuhiro MURATA, Takashi Matsumoto, Taro MITO | 2024-12-24 |
| 12142603 | Bonding of bridge to multiple semiconductor chips | Akihiro Horibe, Toyohiro Aoki, Takashi Hisada, Hiroyuki Mori | 2024-11-12 |