Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11990342 | Metal cut patterning and etching to minimize interlayer dielectric layer loss | Kisup Chung, Ekmini Anuja De Silva, Andrew M. Greene, Indira Seshadri | 2024-05-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11990342 | Metal cut patterning and etching to minimize interlayer dielectric layer loss | Kisup Chung, Ekmini Anuja De Silva, Andrew M. Greene, Indira Seshadri | 2024-05-21 |