Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848302 | Chip package structure with ring-like structure | Sheng-Yao Yang, Ling Li, Yu-Jui Wu, Cheng-Lin Huang, Chien-Chen Li +2 more | 2023-12-19 |
| 11756849 | Package and package-on-package structure having elliptical columns and ellipsoid joint terminals | Sheng-Huan Chiu, Chun-Jen Chen, Chen-Shien Chen, Kuo-Hui Chang, Chung-Yi Lin +2 more | 2023-09-12 |
| 11594484 | Forming bonding structures by using template layer as templates | Mirng-Ji Lii, Chung-Shi Liu, Chin-Yu Ku, Hung-Jui Kuo, Alexander Kalnitsky +3 more | 2023-02-28 |
| 11545463 | Chip package structure with ring-like structure | Sheng-Yao Yang, Ling Li, Yu-Jui Wu, Cheng-Lin Huang, Chien-Chen Li +2 more | 2023-01-03 |