SC

Sheng-Huan Chiu

TSMC: 1 patents #2,163 of 4,064Top 55%
Overall (2023): #258,981 of 537,848Top 50%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11756849 Package and package-on-package structure having elliptical columns and ellipsoid joint terminals Chun-Jen Chen, Chen-Shien Chen, Kuo-Chio Liu, Kuo-Hui Chang, Chung-Yi Lin +2 more 2023-09-12