Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756849 | Package and package-on-package structure having elliptical columns and ellipsoid joint terminals | Sheng-Huan Chiu, Chun-Jen Chen, Chen-Shien Chen, Kuo-Chio Liu, Kuo-Hui Chang +2 more | 2023-09-12 |
| 11735579 | Electrostatic discharge prevention | Ting-Yun Wu, Yen-Sen Wang | 2023-08-22 |
| 11688654 | Test line structure, semiconductor structure and method for forming test line structure | Yen-Chun Lin, Yen-Sen Wang, Bao-Ru Young | 2023-06-27 |
| 11690223 | 3D memory device and manufacturing method thereof | Chih-Hsiung Lee | 2023-06-27 |