Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11769833 | Method for fabricating semiconductor device | Chi-Hsuan Tang, Chung-Ting Huang, Bo-Shiun Chen, Yu-Shu Lin | 2023-09-26 |
| 11756849 | Package and package-on-package structure having elliptical columns and ellipsoid joint terminals | Sheng-Huan Chiu, Chen-Shien Chen, Kuo-Chio Liu, Kuo-Hui Chang, Chung-Yi Lin +2 more | 2023-09-12 |
| 11587835 | Semiconductor device and method for fabricating the same | Tien-I Wu, Yu-Shu Lin | 2023-02-21 |
| 11545560 | Semiconductor device and method for fabricating the same | Wei-Chih Chuang, Chia-Jong Liu, Kuang-Hsiu Chen, Chung-Ting Huang, Chi-Hsuan Tang +7 more | 2023-01-03 |