Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798929 | Semiconductor package | Sang Cheon Park, Dae-Woo Kim, Taehun Kim | 2023-10-24 |
| 11764192 | Semiconductor package including underfill material layer and method of forming the same | Jihwan Hwang, Taehun Kim, Jihwan Suh, Soyoun Lee, Jiseok Hong | 2023-09-19 |
| 11721673 | Semiconductor package having stacked semiconductor chips | Jihoon Kim, Jihwan Suh, Soyoun Lee, Jiseok Hong, Taehun Kim +1 more | 2023-08-08 |
| 11694996 | Semiconductor package including a pad contacting a via | Un-Byoung Kang, Sang Cheon Park, Jinkyeong Seol, Sanghoon Lee | 2023-07-04 |
| 11676925 | Semiconductor packages having improved reliability in bonds between connection conductors and pads and methods of manufacturing the same | Jiseok Hong, Jongpa HONG, Jihwan Hwang, Taehun Kim | 2023-06-13 |
| 11658148 | Semiconductor package and a method for manufacturing the same | Jihoon Kim, Jihwan Suh, So Youn Lee, Jihwan Hwang, Taehun Kim +1 more | 2023-05-23 |
| 11658141 | Die-to-wafer bonding structure and semiconductor package using the same | Jiseok Hong, Unbyoung Kang, Myungsung Kang, Taehun Kim, Sangcheon Park +1 more | 2023-05-23 |
| 11552033 | Packaged multi-chip semiconductor devices and methods of fabricating same | Jongho Lee, Jihoon Kim, Taehun Kim, Sangcheon Park, Jinkyeong Seol +1 more | 2023-01-10 |