Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11658141 | Die-to-wafer bonding structure and semiconductor package using the same | Jiseok Hong, Unbyoung Kang, Taehun Kim, Sangcheon Park, Hyuekjae Lee +1 more | 2023-05-23 |
MK
Myungsung Kang
Overall (2023): #315,813 of 537,848Top 60%
1
Patents 2023