Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824045 | Semiconductor package and method of manufacturing the semiconductor package | Junghwan Kim | 2023-11-21 |
| 11749662 | Semiconductor package | Youngmin Lee | 2023-09-05 |
| 11658141 | Die-to-wafer bonding structure and semiconductor package using the same | Jiseok Hong, Unbyoung Kang, Myungsung Kang, Taehun Kim, Hyuekjae Lee +1 more | 2023-05-23 |
| 11621247 | Semiconductor package | Youngmin Lee | 2023-04-04 |
| 11552033 | Packaged multi-chip semiconductor devices and methods of fabricating same | Hyuekjae Lee, Jongho Lee, Jihoon Kim, Taehun Kim, Jinkyeong Seol +1 more | 2023-01-10 |