Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764192 | Semiconductor package including underfill material layer and method of forming the same | Jihwan Hwang, Taehun Kim, Jihwan Suh, Soyoun Lee, Hyuekjae Lee | 2023-09-19 |
| 11721673 | Semiconductor package having stacked semiconductor chips | Hyuekjae Lee, Jihoon Kim, Jihwan Suh, Soyoun Lee, Taehun Kim +1 more | 2023-08-08 |
| 11676925 | Semiconductor packages having improved reliability in bonds between connection conductors and pads and methods of manufacturing the same | Hyuekjae Lee, Jongpa HONG, Jihwan Hwang, Taehun Kim | 2023-06-13 |
| 11658141 | Die-to-wafer bonding structure and semiconductor package using the same | Unbyoung Kang, Myungsung Kang, Taehun Kim, Sangcheon Park, Hyuekjae Lee +1 more | 2023-05-23 |
| 11647627 | Integrated circuit device | Sangho Lee, Seoryong Park, Jiyoung Ahn, Kiseok Lee, Yoonyoung Choi +1 more | 2023-05-09 |
| 11557596 | Semiconductor memory device | Seoryong Park, Seunguk Han, Jiyoung Ahn, Kiseok Lee, Yoonyoung Choi | 2023-01-17 |