Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791308 | Semiconductor package | Jihwan Hwang, Unbyoung Kang, Sangsick Park, Soyoun Lee, Teakhoon Lee | 2023-10-17 |
| 11764192 | Semiconductor package including underfill material layer and method of forming the same | Jihwan Hwang, Taehun Kim, Soyoun Lee, Hyuekjae Lee, Jiseok Hong | 2023-09-19 |
| 11721673 | Semiconductor package having stacked semiconductor chips | Hyuekjae Lee, Jihoon Kim, Soyoun Lee, Jiseok Hong, Taehun Kim +1 more | 2023-08-08 |
| 11658148 | Semiconductor package and a method for manufacturing the same | Hyuekjae Lee, Jihoon Kim, So Youn Lee, Jihwan Hwang, Taehun Kim +1 more | 2023-05-23 |