Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791308 | Semiconductor package | Unbyoung Kang, Sangsick Park, Jihwan Suh, Soyoun Lee, Teakhoon Lee | 2023-10-17 |
| 11764192 | Semiconductor package including underfill material layer and method of forming the same | Taehun Kim, Jihwan Suh, Soyoun Lee, Hyuekjae Lee, Jiseok Hong | 2023-09-19 |
| 11721673 | Semiconductor package having stacked semiconductor chips | Hyuekjae Lee, Jihoon Kim, Jihwan Suh, Soyoun Lee, Jiseok Hong +1 more | 2023-08-08 |
| 11676925 | Semiconductor packages having improved reliability in bonds between connection conductors and pads and methods of manufacturing the same | Jiseok Hong, Hyuekjae Lee, Jongpa HONG, Taehun Kim | 2023-06-13 |
| 11658141 | Die-to-wafer bonding structure and semiconductor package using the same | Jiseok Hong, Unbyoung Kang, Myungsung Kang, Taehun Kim, Sangcheon Park +1 more | 2023-05-23 |
| 11658148 | Semiconductor package and a method for manufacturing the same | Hyuekjae Lee, Jihoon Kim, Jihwan Suh, So Youn Lee, Taehun Kim +1 more | 2023-05-23 |