Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842982 | Semiconductor package with curing layer between semiconductor chips | Seon Ho Lee, Hwail Jin | 2023-12-12 |
| 11676925 | Semiconductor packages having improved reliability in bonds between connection conductors and pads and methods of manufacturing the same | Jiseok Hong, Hyuekjae Lee, Jihwan Hwang, Taehun Kim | 2023-06-13 |