HJ

Hwail Jin

Samsung: 1 patents #7,162 of 17,037Top 45%
🗺 California: #26,301 of 67,585 inventorsTop 40%
Overall (2023): #418,582 of 537,848Top 80%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11842982 Semiconductor package with curing layer between semiconductor chips Seon Ho Lee, Jongpa HONG 2023-12-12