Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791308 | Semiconductor package | Jihwan Hwang, Sangsick Park, Jihwan Suh, Soyoun Lee, Teakhoon Lee | 2023-10-17 |
| 11705323 | Wafer trimming device | Jungseok Ahn, Chungsun Lee, Teakhoon Lee | 2023-07-18 |
| 11688707 | Semiconductor package | Joonho Jun, Sangsick Park | 2023-06-27 |
| 11658141 | Die-to-wafer bonding structure and semiconductor package using the same | Jiseok Hong, Myungsung Kang, Taehun Kim, Sangcheon Park, Hyuekjae Lee +1 more | 2023-05-23 |
| 11587906 | Package structures having underfills | Jinwoo Park, Jongho Lee, Teakhoon Lee | 2023-02-21 |
| 11569145 | Semiconductor package with thermal interface material for improving package reliability | Sanghyun Lee, Juhyun Lyu, Chulwoo Kim, Jongho Lee | 2023-01-31 |